In-Situ Friction and Pad Topography Measurements During CMP
نویسندگان
چکیده
منابع مشابه
In-Situ Investigation of Wafer-Slurry-Pad Interactions during CMP
The objective of this project is to acquire in-situ data during chemical mechanical planarization (CMP) including slurry film thickness and flow, wafer-pad contact, waferscale friction, and small-scale shear force measurements. The unifying project goal is to utilize a consistent set of experimental data to develop better physical understanding of material removal rate (MRR) and polish quality ...
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ژورنال
عنوان ژورنال: MRS Proceedings
سال: 2004
ISSN: 0272-9172,1946-4274
DOI: 10.1557/proc-816-k5.4